Technical Specifications​

Function: ESC bias and clamp voltage control

Core part number: 27-034079-01

Interface: dedicated high-voltage and communication connectors

Environment: cleanroom, EMI-sensitive

Mounting: internal equipment module

Functional Features​

Precise DC offset compensation

Stable wafer clamping force

Feedback-controlled high-voltage output

Compatible with etch and deposition chambers

Application Scenarios​

Semiconductor wafer processing

Plasma etch systems

Thin-film deposition tools

Novellus-type process platforms

Working Principle​

Converts and regulates internal supply into controlled high-voltage DC, monitors electrode voltage/current, and compensates drift to maintain uniform electrostatic attraction.

Installation Requirements​

Install inside qualified semiconductor tool

Use specified high-voltage cabling

Maintain cleanroom and ESD controls

Usage Notes​

Only service with trained semiconductor maintenance personnel.

Verify interlock and leakage current limits.

Do not operate with damaged high-voltage connectors.