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GE IS200TRESH1A

Product Name:​ TRESH (Terminal Board Relay Output — High Density) Board for Mark VIe Speedtronic
Product Introduction:​ The IS200TRESH1A is a high-density relay output termination board for GE’s Mark VIe Speedtronic turbine control system. It packs more relays into the same footprint as the standard TREGH series, addressing space-constrained turbine control cabinet applications. It handles general-purpose relay outputs for annunciators, indicator lights, and interposing relays.

Detailed content

Technical Specifications:
  • Nominal voltage: 24 V DC
  • Output type: Relay, high-density layout
  • Channel count: Higher than TREGH H1 variant
  • Relay contact material: Improved in the “A” revision for longer life in cycling applications
  • Connector type: 37-pin D-sub and terminal blocks
  • Mounting: DIN-rail or chassis mount
  • Operating temperature: 0 to 60°C (ambient)
  • Relative humidity: 5% to 95% (non-condensing)
  • Compatible rack: Mark VIe IS200 series backplane
Functional Features:
  • Higher relay density than the TREGH series—saves cabinet space
  • The “A” revision adds improved relay contact material for extended cycling life
  • Drop-in replacement for the base IS200TRESH1 (identical pinout, mounting, and software interface; no software change required)
  • Handles both AC and DC loads via relay contacts
Material Composition:​ Industrial-grade PCB, D-sub connectors, spring or screw terminal blocks, electromechanical relays with upgraded contact material on the “A” revision.
Structural Characteristics:
  • Compact footprint relative to relay count
  • 37-pin D-sub connector plus terminal blocks
  • DIN-rail or chassis-mount form factor
  • Designed for dense packing of relays in a constrained area
Working Principle:​ The Mark VIe controller drives the board’s relays through the backplane interface. Each relay’s contacts close or open to switch field devices such as annunciators, indicator lights, or interposing relays. The high-density layout achieves more relay channels within the same board envelope as the standard TREGH series.
Installation Requirements:​ Mount on DIN rail or directly to chassis. Terminate field wiring on the terminal blocks and the 37-pin D-sub connection. Confirm the board is the “A” revision drop-in for an existing IS200TRESH1 base board—no software reconfiguration needed. If replacing a TREGH, TPROH, or TBCI board, budget 4-8 hours for software rework and validation.
Usage Precautions:​ Pay increased attention to thermal management due to the higher relay density. Verify relay contact ratings against the actual switched load. The “A” revision is a direct replacement for IS200TRESH1 with no software changes; however, cross-series replacements (TREGH, TPROH, TBCI) require software reconfiguration and validation.

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