• Material: High-Purity Fused Quartz (SiO2) or Synthetic Quartz
• Purity: >99.99% SiO2 to prevent metallic contamination
• Dimensions: Custom-fitted for specific chamber geometries (e.g., AWD series)
• Thickness: 5mm to 10mm depending on the specific zone
• Surface Finish: Polished interior to minimize particle adhesion

Functional Features:

• Contamination Barrier: Prevents metal ions from the stainless steel chamber walls from migrating onto the wafer.
• Chemical Resistance: Highly resistant to strong acids (H2SO4, HF), bases, and plasma halogen species.
• Particle Trap: Smooth surfaces reduce particle generation; the liner acts as a trap for any particles generated during maintenance.
• UV Transparency: Allows optical sensors to view the plasma or wafer through the chamber walls.

Application Scenarios:

• Plasma Chamber Protection: Shields the expensive main chamber vessel from fluorine-based plasma etching.
• Wet Bench Isolation: Used in immersion tanks to isolate wafers from metallic tank walls during RCA cleans.
• High-Purity Processing: Essential for manufacturing high-yield semiconductor devices where trace metals cause failures.
• Preventive Maintenance: Replaced periodically during scheduled tool maintenance to restore particle performance.