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Gasonics AWD-D-3-8-005
Product Description: The Gasonics AWD-D-3-8-005 is a variation of the AWD-D-3-8 series, likely representing a specific hardware upgrade or a configuration optimized for advanced packaging applications. The “005” revision often implies enhanced RF power capabilities or specialized gas handling options compared to the “002” version.
Technical Specifications:
- System Type: Advanced Dual-Chamber Decoupled Plasma Strip System
Detailed content
- Wafer Size: 200mm (8-inch) and 300mm (12-inch) compatible configurations
- RF Power: Enhanced 3000W – 5000W per chamber option
- Gas Handling: Expanded gas box with up to 8 independent gas lines (including NF3 or specialized chemistries)
- Pressure Control: High-precision throttle valve with wide dynamic range (1 mTorr to 5 Torr)
- Cooling: Enhanced chiller system for high-power operation
Functional Features:
- High-Density Plasma Option: Capable of generating higher radical densities for stripping very thick or hard-baked resists.
- Advanced Endpoint Detection: Multi-wavelength optical emission spectroscopy for detecting complex strip endpoints.
- SEC/GEM Compliance: Full factory automation interface for integration into modern fabs.
- Remote Service Port: Allows for remote diagnostics by Gasonics service engineers.
Application Scenarios:
- 3D NAND String Release: Stripping of thick sacrificial layers in 3D NAND structures.
- Through-Silicon Vias (TSV): Deep via cleaning and resist removal for 3D packaging.
- Fan-Out Packaging (FOWLP): Resist stripping on reconstituted wafers.
- Power Device Manufacturing: Heavy metallization resist stripping.
