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Gasonics AWD-D-3-8-002
Product Description: The Gasonics AWD-D-3-8-002 is a specific revision of the AWD-D series, configured as a Dual Chamber Decoupled Plasma Strip System. The “3” often indicates a 3-slot load lock or a specific generation, while “8” denotes 200mm (8-inch) wafer capability. The “002” is a hardware revision code. It is designed for high-throughput production environments.
Technical Specifications:
- System Type: Dual-Chamber Downstream Plasma Stripper
Detailed content
- Wafer Size: 200mm (8-inch) primary, with 150mm (6-inch) capability
- Chambers: Two independent process chambers sharing a common vacuum and gas handling system
- RF Power: 2000W per chamber (Solid State Generator)
- Load Lock: 3-slot cassette loader (FOUP or Cassette)
- Throughput: Up to 100 wafers per hour (depending on recipe)
Functional Features:
- Parallel Processing: Allows two wafers to be processed simultaneously, doubling throughput compared to single-chamber tools.
- Independent Recipe Control: Each chamber can run a different recipe (gas mix, power, time) simultaneously.
- Automated Handling: Integrated robotic arm transfers wafers between load lock and process chambers without human intervention.
- In-Situ Monitoring: Real-time monitoring of RF match, pressure, and gas flows.
Application Scenarios:
- High-Volume Memory Production: Stripping resist in DRAM and NAND flash manufacturing.
- Foundry Logic: Critical layer stripping for advanced logic nodes.
- MEMS Fabrication: High-throughput ashing for MEMS release steps.
- Compound Semiconductors: Processing GaN and SiC wafers for power electronics.
