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Gasonics AWD-D-3-7-005
Product Description: This model represents an advanced configuration of the Gasonics AWD-D series, specifically a High-Throughput Decoupled Plasma Strip System. The “3-7” designation often implies a 3-chamber configuration or a specific generation tailored for 300mm (12-inch) wafer compatibility, while “005” denotes a specific hardware revision with enhanced capabilities. It is designed for the most demanding production environments.
Technical Specifications:
- System Type: Multi-Chamber Downstream Plasma Asher
Detailed content
- Wafer Size: 200mm (8-inch) and 300mm (12-inch) compatible
- RF Power: Up to 5000W per chamber (Dual Frequency option available)
- Gas Handling: Advanced gas box with 8+ independent mass flow controllers (MFCs)
- Vacuum System: Turbo-molecular pumps with cryogenic trapping options
- Interface: SEC/GEM standard for factory automation
Functional Features:
- Dual-Frequency Capability: Allows independent control of ion energy (low frequency) and radical density (high frequency) for optimized process control.
- Cryogenic Pumping: Integrated cold traps to capture volatile byproducts and prevent pump oil backstreaming.
- Advanced Endpoint Detection: High-sensitivity optical emission spectroscopy (OES) to detect process completion precisely.
- Cluster Tool Ready: Designed for integration into large cluster tools with central robotic handling.
Application Scenarios:
- 300mm Logic/Memory Fabs: High-volume production of advanced semiconductor nodes (7nm, 5nm).
- 3D NAND Manufacturing: Stripping of complex multi-layer sacrificial stacks.
- TSV Processing: Deep via cleaning for 2.5D and 3D packaging.
- Power Semiconductors: Heavy metallization resist stripping for IGBT and SiC modules.
