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Gasonics AWD-D-2-3-002
Product Description: The Gasonics AWD-D-2-3-002 is a specific configuration of the Automated Wet Decoupled (AWD) plasma stripping system. It features a dual-chamber architecture designed for high-throughput photoresist removal and surface cleaning. The nomenclature indicates a dual-chamber setup (“2”), a 3-slot load lock configuration (“3”), and a specific hardware revision (“002”). It separates plasma generation from the wafer surface to prevent ion damage.
Technical Specifications:
- System Type: Dual-Chamber Downstream Plasma Strip System
Detailed content
- Wafer Size: 150mm (6-inch) and 200mm (8-inch) compatible
- RF Power: 1000W to 3000W per chamber (Solid State Generator)
- Chambers: Two independent process chambers with shared gas handling and vacuum systems
- Load Lock: 3-slot cassette handler for automated wafer transfer
- Pressure Range: 10 mTorr to 2 Torr
- Process Gases: O2, N2, Ar, CF4, and specialized chemistries
Functional Features:
- Parallel Processing: Capability to run two different recipes simultaneously in separate chambers, significantly increasing throughput.
- Decoupled Plasma Source: Remote plasma generation ensures only neutral radicals reach the wafer, preserving delicate device structures.
- Automated Material Handling: Integrated robotic arm transfers wafers between the load lock and process chambers without atmospheric exposure.
- Advanced Process Control: Real-time monitoring of RF power, pressure, gas flows, and temperature with recipe storage capabilities.
Application Scenarios:
- High-Volume Manufacturing: DRAM and NAND flash memory production requiring continuous 24/7 operation.
- Logic Foundries: Critical resist stripping after ion implantation and etch processes.
- MEMS Fabrication: Removal of sacrificial layers and photoresist without stiction or damage to micro-structures.
- Compound Semiconductors: Processing of GaAs, GaN, and SiC wafers for RF and power devices.
