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Gasonics A95-107-01 B Plasma Chamber Component
Product Description: This part number identifies a specific mechanical sub-assembly, likely an electrode or showerhead assembly, utilized in Gasonics plasma processing equipment. It is designed to introduce process gases into the reaction chamber uniformly and serve as the powered or grounded surface for plasma generation. The “B” revision indicates a specific design iteration.
Technical Specifications:
- Material: Aluminum, Anodized Aluminum, or Stainless Steel (316L) with ceramic insulators (Quartz or Alumina).
Detailed content
- Gas Distribution: Multi-hole showerhead design for uniform gas flow.
- RF Compatibility: Capable of carrying RF power (if powered electrode) or providing a ground path.
- Sealing: Utilizes elastomer or metal gaskets (Viton or Kalrez) for vacuum integrity.
- Dimensions: Specific to chamber size (e.g., 200mm or 300mm wafer compatibility).
Functional Features:
- Uniform Gas Injection: Ensures even distribution of process gases (Oxygen, Argon, CF4) across the wafer surface.
- Plasma Confinement: Shapes the electric field to maintain a stable plasma sheath.
- Temperature Control: May include internal channels for temperature regulation to prevent overheating during exothermic plasma reactions.
- Easy Maintenance: Designed for removal and cleaning or replacement of wear parts like ceramic liners.
Application Scenarios:
- Dielectric Etch: Used in chambers for etching oxide or nitride layers.
- Ashing: Specifically designed for oxygen plasma ashing processes where high uniformity is required.
- PECVD Support: Used in pre-treatment cleaning steps before chemical vapor deposition.
- Wafer-level Packaging: Cleaning and activating surfaces for bonding processes.
