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Extreme Networks Summit X670V Series Layer 3 Switch
Technical Specifications:
- Form Factor: 1U rack-mountable
- Port Configuration:
- 48 x 10GbE SFP+ ports
- 4 x 40GbE QSFP+ ports (supporting 4x10GbE breakout)
- Layer Support: Layer 2/3
- Throughput: Up to 1.28 Tbps
- Redundancy: Dual hot-swappable power supplies
- Management: Web-based, CLI, SNMP v1/v2c/v3, Telnet, DHCP
- Warranty: 1-year limited warranty
Detailed content
Key Features:
- High Port Density: Enables cost-effective scaling in dense network environments.
- Advanced Routing: Supports OSPF, BGP, and VRRP for dynamic network resilience.
- Quality of Service (QoS): Prioritizes critical traffic with 802.1p, DSCP, and rate-limiting policies.
- Virtualization: VLAN support for network segmentation and security.
Applications:
- Data Centers: Ideal for top-of-rack (ToR) or spine-leaf architectures.
- Enterprise Core: Aggregates traffic from access-layer switches with high-speed uplinks.
- High-Performance Computing (HPC): Supports low-latency interconnects for clustered applications.