Digital guide

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Extreme Networks Summit X670V Series Layer 3 Switch

Technical Specifications:

  • Form Factor: 1U rack-mountable
  • Port Configuration:
    • 48 x 10GbE SFP+ ports
    • 4 x 40GbE QSFP+ ports (supporting 4x10GbE breakout)
  • Layer Support: Layer 2/3
  • Throughput: Up to 1.28 Tbps
  • Redundancy: Dual hot-swappable power supplies
  • Management: Web-based, CLI, SNMP v1/v2c/v3, Telnet, DHCP
  • Warranty: 1-year limited warranty

Detailed content

Key Features:

  • High Port Density: Enables cost-effective scaling in dense network environments.
  • Advanced Routing: Supports OSPF, BGP, and VRRP for dynamic network resilience.
  • Quality of Service (QoS): Prioritizes critical traffic with 802.1p, DSCP, and rate-limiting policies.
  • Virtualization: VLAN support for network segmentation and security.

Applications:

  • Data Centers: Ideal for top-of-rack (ToR) or spine-leaf architectures.
  • Enterprise Core: Aggregates traffic from access-layer switches with high-speed uplinks.
  • High-Performance Computing (HPC): Supports low-latency interconnects for clustered applications.

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