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AMAT LI-9496 Wafer Level Inspection Camera Module

Product Overview: The AMAT LI-9496 is a high-resolution wafer level inspection camera module designed for Applied Materials semiconductor wafer inspection systems. It provides real-time, high-resolution imaging of wafer surfaces, detecting defects, particles, and process variations during manufacturing. This module features advanced CCD/CMOS sensor technology, high-speed data transfer, and seamless integration with AMAT’s inspection software, enabling precise wafer quality control.

Technical Specifications:

  • Sensor Type: 12-megapixel CMOS sensor, with a global shutter for high-speed imaging.
  • Resolution: 4096×3072 pixels, with a pixel size of 3.45μm.

Detailed content

  • Frame Rate: 30 frames per second (fps) at full resolution, 120 fps at reduced resolution.
  • Interface: USB 3.0 and GigE Vision, supporting high-speed data transfer up to 5 Gbps.
  • Lens: Fixed-focus high-resolution industrial lens, with a field of view of 300mm×225mm.
  • Operating Environment: Cleanroom Class 1, temperature 18–25°C, humidity 40–60% (non-condensing).
  • Lighting: Integrated LED ring light (white, 5000K), with adjustable intensity.
  • Dimensions: 150mm×100mm×80mm, weight 1.2kg.
  • Certification: Complies with SEMI S2/S8 safety standards and ISO 14644-1 cleanroom requirements.

    Functional Features:

  • Delivers high-resolution, real-time wafer imaging for defect detection.
  • Provides fast data transfer for real-time inspection and analysis.
  • Integrated LED lighting ensures uniform illumination for accurate defect detection.
  • Seamless integration with AMAT’s wafer inspection software for automated quality control.
  • Features rugged, cleanroom-compatible construction for long-term reliability.
  • Supports remote monitoring and control for fab-wide quality management.

    Application Scenarios:

  • Installed in AMAT wafer inspection systems for in-line and post-process defect detection.
  • Used in 200mm and 300mm wafer fabs for logic, memory, and power semiconductor manufacturing.
  • Applied in processes requiring high-precision defect detection (≤5nm nodes).
  • Ideal for high-volume production lines requiring 100% wafer quality inspection.
  • Deployed in R&D facilities for wafer process development and defect analysis.

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