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AMAT ESC-W2
Product Name: Electrostatic Chuck (ESC) W2 Series Wafer Clamp
Product Description: A high-performance, dual-zone or single-zone electrostatic chuck designed for non-contact clamping of wafers in advanced semiconductor processes. It uses Coulomb or Johnsen-Rahbek forces to secure the wafer and provides precise temperature control.
Technical Specifications:
- Clamping Technology: Dual-zone Coulombic clamping for superior uniformity.
Detailed content
- Wafer Size: Compatible with 200mm and 300mm wafers.
- Material: High-purity aluminum nitride (AlN) or alumina (Al₂O₃) ceramic.
- Temperature Control: Integrated heating elements with closed-loop control (100°C to 450°C).
- RF Compatibility: Designed for high-RF power biasing (up to 10kW).
Functional Features:
- Delivers exceptional wafer temperature uniformity (±0.5°C).
- Provides strong, stable clamping force with minimal wafer backside contamination.
- Rapid heating and cooling ramps for high-throughput processes.
- Excellent dielectric strength and resistance to plasma erosion.
Application Scenarios:
- Deployed in advanced Etch, PVD, and ALD processes on Centura and Endura platforms.
- Ideal for critical low-k dielectric and high-value metal layer processes.
