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AMAT 9090-01247 Equipment Cooling System Heat Exchanger
Product Overview: The AMAT 9090-01247 is a high-efficiency heat exchanger designed for use in the cooling systems of Applied Materials semiconductor equipment. It is responsible for removing heat generated by internal components (e.g., RF power supplies, process chambers, motors) to maintain optimal operating temperatures and prevent equipment overheating. This heat exchanger is engineered with advanced heat transfer technology and corrosion-resistant materials to ensure efficient heat dissipation, long-term reliability, and compatibility with semiconductor cleanroom environments.
Technical Specifications: – Heat Transfer Capacity: 5000 W (typical), with a maximum capacity of 7000 W. – Cooling Medium: Deionized water (DI water) or ethylene glycol/water mixture (50/50), compatible with AMAT’s cooling systems.
Detailed content
– Flow Rate: 10-20 liters per minute (LPM), with a pressure drop of ≤ 0.1 MPa at maximum flow rate. – Material Composition: Heat exchanger core made of copper (or optional stainless steel) for excellent thermal conductivity; housing made of 316L stainless steel for corrosion resistance. – Heat Transfer Coefficient: ≥ 1000 W/m²·K, ensuring efficient heat transfer. – Operating Temperature: Inlet cooling medium temperature: 15-25°C, outlet cooling medium temperature: 25-35°C; equipment component temperature: ≤ 40°C. – Physical Dimensions: 300mm (L) × 200mm (W) × 150mm (H), weight: 8kg. – Protection Features: Built-in flow sensor and temperature sensor to monitor cooling system performance; over-temperature alarm for system protection. – Certification: Complies with SEMI S2/S8 safety standards and ISO 9001 quality control requirements.
Functional Features: – Efficiently removes heat from equipment components, maintaining optimal operating temperatures and preventing overheating-induced damage. – Features a compact, high-density heat transfer core to maximize heat dissipation in a small footprint, suitable for tight equipment spaces. – Resists corrosion from deionized water and cooling fluids, extending component service life (typical service life: 20,000+ operational hours). – Provides real-time monitoring of flow rate and temperature via integrated sensors, enabling proactive maintenance and system optimization. – Designed to be compatible with AMAT’s cooling system controls, allowing for automated adjustment of cooling flow rate based on equipment temperature. – Minimizes pressure drop, ensuring efficient operation of the cooling system and reducing energy consumption. – Easy to clean and maintain, with removable end caps for access to the heat transfer core.
Application Scenarios: – Installed in AMAT’s RF power supplies, process chambers, robot control modules, and vacuum pumps. – Used in 200mm and 300mm wafer manufacturing lines for logic chips, memory chips, and power semiconductor devices. – Applied in high-power semiconductor equipment (e.g., high-frequency RF systems, large-scale plasma chambers) where heat generation is significant. – Suitable for semiconductor cleanroom environments (Class 1-100), where cleanliness and corrosion resistance are critical. – Ideal for high-volume production lines, where equipment uptime and thermal stability are essential to maintaining production efficiency. – Used in research and development facilities for cooling prototype equipment and high-power test modules.
