Technical Specifications​

Functional Features​

Brightfield and darkfield channels reveal different defect types. CCD imaging with 1.0 micrometer resolution supports particle and pattern review. Programmable recipes allow separate inspection plans for bare, patterned and film wafers. SQL data storage enables lot tracing, trend analysis and yield reports.

Application Scenarios​

Incoming wafer quality control, lithography and etch process monitoring, deposition and cleaning verification, particle contamination analysis, final manufacturing inspection and engineering defect characterization in 300 mm semiconductor lines.

Performance Parameters​

The platform inspects up to 300 mm wafers with a 22 mm x 22 mm imaging region per configured scan. Stated resolution is 1.0 micrometer with 50 nm-class defect detection in supported recipes. Throughput reaches 150 wafers per hour when optics, stage speed, recipe complexity and fab host interface are qualified.

Material Composition​

System structure uses machined aluminum or stainless framework, optical glass lenses, LED illuminators, CCD sensor assembly, motion stage components, industrial computer hardware and cleanroom-compatible polymer or stainless enclosures.

Structural Characteristics​

The equipment contains an optical head, illumination module, precision wafer stage, CCD camera, vibration-controlled base, control computer, human-machine interface and database server connection. Wafer handling and optical paths are enclosed to maintain cleanroom and contamination-control requirements.

Working Principle​

The wafer stage positions the substrate under the optical head. LED light is directed through brightfield or darkfield geometry. Reflected or scattered light is captured by the CCD camera and converted to digital images. Software compares the image against trained or rule-based references, classifies particles, scratches and pattern defects, and stores results in the SQL database for lot-level analysis.

Installation Requirements​

Install in a controlled cleanroom with specified temperature, humidity, vibration isolation and power quality. Provide stabilized facility power, compressed air or vacuum if required by the tool option, network connection to the fab host or MES, and qualified exhaust or ESD controls. Level the system base, align the optical stage and run AMAT qualification recipes before production use.

Usage Notes​

Perform regular optical calibration, LED intensity check, stage cleanliness verification and defect-recipe validation. Restrict access to trained semiconductor equipment technicians. Use only AMAT-approved software versions and spare parts. Because 3096-1000 can also appear as other vendors’ part numbers in unrelated industries, confirm the AMAT wafer-inspection context through the asset tag, bill of materials or fab procurement record before ordering spares.