Digital guide
You are here:
AMAT 0680-01972 Ultra-High Vacuum (UHV) Valve Component
Product Overview: The AMAT 0680-01972 is a high-performance ultra-high vacuum valve component designed for use in the vacuum subsystems of Applied Materials semiconductor equipment. It is responsible for controlling the vacuum path, isolating process chambers from vacuum pump systems, and maintaining the ultra-high vacuum environment required for semiconductor processing. This component is engineered with precision machining and advanced sealing technology to ensure exceptional air tightness, durability, and compatibility with harsh process gases. It is a critical part of AMAT’s vacuum systems, enabling reliable and consistent semiconductor manufacturing processes.
Technical Specifications: – Vacuum Rating: Ultra-high vacuum (UHV) with a base pressure ≤ 1×10⁻⁹ Pa, leak rate ≤ 1×10⁻¹² Pa·m³/s (He). – Material Composition: Body made of 316L stainless steel (ASTM A240) for excellent corrosion resistance and high-temperature stability; sealing material: copper gasket (or optional Viton for specific gas compatibility).
Detailed content
– Flange Interface: Compatible with standard CF (ConFlat) flanges (size: 2.75 inches), with a precision-machined flange surface (surface roughness ≤ 0.8 μm) for optimal sealing. – Operating Temperature: -30°C to 200°C, with a maximum temperature resistance of 250°C for short-term operation. – Actuation Type: Pneumatic actuation (air pressure: 0.4-0.6 MPa), with manual override for emergency operation. – Opening/Closing Time: ≤ 0.5 seconds (opening), ≤ 0.8 seconds (closing), ensuring rapid vacuum isolation. – Service Life: ≥ 10,000 cycles under standard operating conditions, with minimal maintenance requirements. – Certification: Complies with SEMI F17 standards for vacuum components and ISO 14644-1 for cleanroom compatibility.
Functional Features: – Enables rapid opening and closing of the vacuum path, allowing for quick isolation of the process chamber from the vacuum pump system during maintenance or process changes. – Maintains exceptional air tightness to prevent air leakage and contamination of the process environment, ensuring the purity of the vacuum. – Resists corrosion from process gases (e.g., CF₄, Cl₂, NH₃) and plasma exposure, extending component service life and reducing replacement frequency. – Features a non-stick sealing design to prevent gasket adhesion and ensure reliable operation over multiple cycles. – Provides position feedback (open/closed status) to the equipment control system, enabling real-time monitoring and closed-loop control. – Designed to minimize particle generation, with a smooth internal surface and minimal dead volume to prevent gas trapping and particle accumulation. – Compatible with AMAT’s vacuum control system, allowing for automated operation and integration with the overall equipment workflow.
Application Scenarios: – Installed in AMAT’s vacuum subsystems, including turbomolecular pumps, roots pumps, and vacuum gauge assemblies. – Used in process chambers requiring ultra-high vacuum environments, such as etching (dry etching, plasma etching), CVD, PVD, and ion implantation. – Applied in wafer processing equipment for 200mm and 300mm wafers, including logic chips, memory chips, and power semiconductor devices. – Suitable for semiconductor fabs with strict cleanliness and vacuum requirements, where process consistency and contamination control are critical. – Ideal for high-volume production lines, where equipment uptime and component reliability are essential to maintaining production efficiency. – Used in research and development laboratories for advanced semiconductor process development, where precise vacuum control is required.
