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AMAT 0240-20067 Ceramic Heater Assembly
Product Overview: The AMAT 0240-20067 is a high-performance ceramic heater assembly designed for use in Applied Materials semiconductor processing equipment. It provides precise, uniform heating for process chambers, wafers, and other critical components, ensuring optimal temperature conditions for semiconductor manufacturing processes such as CVD, PVD, and thermal annealing. This heater assembly is engineered with high-purity ceramic materials and advanced heating elements, offering exceptional thermal stability, uniform heat distribution, and resistance to plasma and chemical attack. It is a critical component for maintaining process consistency and wafer quality.
Technical Specifications:
– Material Composition: Heater core made of high-purity alumina (Al₂O₃) ceramic (99.99% purity), with a tungsten heating element embedded within the ceramic.
– Dimensions: Diameter 300mm, thickness 15mm, designed for 300mm wafer processing.
– Temperature Range: Operating temperature: 0-800°C, with a maximum temperature of 1000°C for short-term operation.
Detailed content
– Temperature Uniformity: ±2°C across the heating surface (300mm diameter), ensuring uniform wafer heating. – Power Rating: 5000W (continuous wave), with adjustable power range: 0-5000W (step size: 10W). – Thermal Conductivity: 35 W/m·K, ensuring efficient heat transfer to the wafer or process chamber. – Operating Environment: Resistant to plasma (CF₄, Cl₂, Ar) and process gases; suitable for high-vacuum conditions (base pressure ≤ 1×10⁻⁸ Pa). – Service Life: ≥ 8000 process hours under standard operating conditions. – Certification: Complies with SEMI S2/S8 safety standards and ISO 9001 quality control requirements.
Functional Features: – Provides precise, uniform heating of wafers and process chambers, ensuring consistent process conditions and wafer quality. – Features embedded heating elements that distribute heat evenly across the entire surface, eliminating hot spots and cold zones. – Resists plasma erosion and chemical attack, extending the heater’s service life and reducing maintenance frequency. – Withstands high temperatures and thermal cycling without warping or cracking, ensuring long-term reliability. – Integrates with AMAT’s process control system, enabling real-time temperature adjustment and closed-loop control. – Minimizes particle generation, with a smooth ceramic surface that prevents dust accumulation and contamination. – Designed for easy installation and replacement, reducing maintenance downtime and improving equipment availability.
Application Scenarios: – Installed in AMAT’s CVD, PECVD, and thermal annealing systems for 300mm wafer processing. – Used to heat wafers during thin film deposition, plasma etching, and thermal treatment processes. – Applied in process chambers where uniform temperature distribution is critical to process uniformity. – Suitable for semiconductor fabs manufacturing logic chips, memory chips (DRAM, NAND), and power semiconductor devices. – Ideal for high-volume production lines, where equipment uptime and process consistency are essential. – Used in research and development facilities for advanced thermal process testing and optimization.
