Digital guide
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Technical Specifications:
- Material: High-purity alumina (Al₂O₃) ceramic composite
- Heating Element: Embedded multi-zone resistance heating circuit
- Temperature Range: Ambient to 450°C
- Temperature Uniformity: ±1.5°C across wafer surface
- Diameter: Compatible with 200mm wafer processing
- Dielectric Strength: > 15 kV/mm
- Weight: 3.0 kg
Functional Features:
- Uniform thermal distribution for consistent wafer processing
- High dielectric strength for electrostatic chuck (ESC) operation
- Low outgassing rate for ultra-high vacuum (UHV) compatibility
- Excellent thermal shock resistance under rapid thermal cycling
- High mechanical stability to maintain wafer planarity
- Corrosion resistance to process gases and cleaning chemistries
Application: Used as a heating and clamping pedestal in PVD, CVD, and ALD chambers on Endura platforms.
