Detailed content
- Diameter: 200mm/300mm wafer compatible (294.6mm OD)
- Profile: Precision-machined overlapping design
- Flatness: ≤ 10μm
- Surface: Double-side polished
Functional Features:
- Edge Pre-Heating: Eliminates thermal gradients at wafer perimeter
- Uniform Deposition: Ensures consistent film thickness from center to edge
- Non-Contact: Radiant heating prevents physical wafer contact
- Purity: Ultra-low trace metal content (<1ppb)
Application: Used in poly-silicon and amorphous silicon deposition processes.








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