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AMAT 0200-10368
Product Name: Ceramic Cover Ring Assembly
Product Description: A precision-machined high-performance ceramic ring used around wafer pedestals to control plasma distribution, protect wafer edges and maintain process uniformity during semiconductor etching and deposition procedures.
Technical Specifications:
- Material: High-purity alumina ceramic (Al₂O₃) or yttria-stabilized zirconia (YSZ)
Detailed content
- Purity Level: ≥99.6% to avoid metallic contamination
- Operating Temperature: Up to 850℃ under continuous working conditions
- Surface Treatment: Precision grinding and polishing, Ra ≤0.4μm
- Compatibility: Designed for 200mm/300mm wafer process chambers
Functional Features:
- Effectively confines plasma to improve process uniformity across the wafer
- Reduces edge effects and prevents abnormal deposition or etching at wafer edges
- High mechanical strength and resistance to plasma erosion
- Low particle emission to meet Class 10 cleanroom standards
- Stable chemical inertness to avoid reaction with process gases
Application Scenarios: Used in PVD, CVD and dry etching chambers for wafer edge process control in advanced semiconductor manufacturing lines.
