Digital guide
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Detailed content
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- Diameter: 3.175mm ± 0.005mm
- Length: 76.2mm ± 0.02mm
- Heating Element: Integrated tungsten resistance coil
- Power Rating: 50W at 24V DC
- Temperature Range: Ambient to 450°C
- Functional Features:
- Combines wafer lifting with active temperature control
- Uniform heat distribution to wafer contact area
- Low outgassing materials for vacuum compatibility
- High chemical resistance to process environments
- Precision dimensions for smooth vertical movement
- Application Scenarios:
- Used in AMAT P-5000 and Centura WxZ CVD chambers
- Applied in TEOS and high-density plasma deposition processes
- Deployed in 200mm wafer manufacturing systems
- Utilized in thin film dielectric layer formation
- Suitable for processes requiring precise wafer temperature control
