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AMAT 0200-09626 Flat Process Collar Assembly
Product Description: A precision-machined component designed to provide a uniform process environment around 150mm wafers in semiconductor processing equipment, minimizing edge effects and ensuring process uniformity.
Technical Specifications:
- Wafer Compatibility: 150mm (6-inch) semiconductor wafers
- Material: High-purity, electro-polished 316L stainless steel
- Surface Finish: Ra < 0.8μm for minimal particle generation
Detailed content
- Dimensions: Precision-machined to ±0.005mm tolerances
- Compatibility: Designed for OX, MLR, and NIT process applications
- Mounting: Snap-fit design with alignment pins for precise positioning
- Weight: 0.25kg per unit
Functional Features:
- Creates a uniform process environment across the entire wafer surface
- Minimizes edge effects that can cause process non-uniformity
- Easy installation and removal without special tools
- Chemical resistance to all common semiconductor process chemicals
- Low outgassing properties suitable for high-vacuum environments
- Reusable design with long service life between replacements
Application Scenarios:
- 150mm wafer oxidation processes (OX)
- Multi-layer resist (MLR) processing applications
- Nitride deposition (NIT) processes
- Etch processes requiring uniform plasma distribution
- Process development for 150mm semiconductor manufacturing
