Digital guide
You are here:
AMAT 0200-09200
Product Name: 200mm Edge Ring / Wafer Retaining Ring
Product Description: A precision ring that sits at the perimeter of the 200mm wafer pedestal. It secures the wafer’s edge, ensures uniform gas flow across the edge, and minimizes process effects (e.g., bevel deposition or edge etching).
Technical Specifications:
- Wafer Size: 200mm (8-inch).
Detailed content
- Material: High-purity ceramic (Al₂O₃), silicon carbide (SiC), or coated metal.
- Profile: Precision-machined with a stepped or angled profile to match the wafer edge.
- Tolerances: Dimensional accuracy to ±0.01mm for perfect centering.
- Coating: Optional anti-reflective or plasma-resistant coating.
Functional Features:
- Eliminates edge effects by ensuring consistent process conditions across the entire wafer.
- Prevents process gases from creeping under the wafer, ensuring uniform deposition/etching.
- Shields the outer edge of the ESC or pedestal from coating.
- High wear resistance extends the interval between replacements.
Application Scenarios:
- Used in 200mm PVD, CVD, and Etch processes across Centura and Endura platforms.
- Critical for advanced processes requiring tight within-wafer uniformity (WIW).
