Digital guide
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- Wall Thickness: 5mm
- Temperature Resistance: Up to 1100°C
- Dielectric Strength: ≥20kV/mm
- Surface Finish: Fire-polished internal surfaces
Functional Features:
- Excellent chemical resistance to process gases and plasma
- High thermal shock resistance prevents cracking during thermal cycling
- Ultra-high purity minimizes contamination in critical processes
- Transparent to infrared radiation for efficient heating
- Low particle generation for clean process environments
Application Scenarios:
- Protective liner in Centura DPS etch chambers
- High-temperature semiconductor deposition processes
- Plasma containment in reactive ion etching systems
- Oxide and nitride thin-film growth applications
