Digital guide
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AMAT 0200-05369
Product Name: Gas Distribution Nozzle Assembly
Product Description: A precision-machined component dedicated to uniform injection and distribution of process gases into semiconductor vacuum processing chambers. It stabilizes gas flow patterns to ensure consistent process results across the wafer surface.
Technical Specifications:
- Material: 316L stainless steel with electropolished surface
Detailed content
- Leak Rate: <1×10⁻⁹ atm-cc/sec He
- Operating Temperature: -40°C to +200°C
- Connection Type: VCR male/female fittings
- Surface Finish: Ra ≤ 0.4 μm for low particle generation
- Pressure Compatibility: Full vacuum to 30 PSI
Functional Features:
- Uniform gas dispersion across wafer diameter
- Low turbulence and consistent flow velocity
- High corrosion resistance to reactive process gases
- Minimal dead volume to reduce gas retention
- Excellent vacuum sealing performance
- Easy installation and alignment within chamber
Application Scenarios:
- PECVD and ALD thin film deposition
- Plasma etch process gas injection
- Wafer cleaning and surface treatment systems
- Chamber conditioning and passivation processes
- Semiconductor wafer manufacturing platforms
