Digital guide
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AMAT 0200-01991
Product Name: 200mm Chamber Focus Ring / Gas Baffle
Product Description: A precision-machined annular component installed within 200mm semiconductor process chambers. It functions to focus plasma towards the wafer surface and optimize the distribution of process gases, ensuring uniform thin-film deposition or etching.
Technical Specifications:
- Wafer Compatibility: 200mm (8-inch) wafer systems.
Detailed content
- Material: High-purity, bead-blasted aluminum alloy or stainless steel.
- Design: Features a contoured inner profile with precision gas flow slots.
- Surface Finish: Non-porous, electro-polished or plasma-sprayed coating to minimize particle entrapment.
- Fit: Engineered for exact OEM fitment in Centura and Producer series chambers.
Functional Features:
- Confines and focuses plasma energy directly onto the wafer, improving process uniformity.
- Directs process gases evenly across the wafer surface for consistent layer growth.
- Shields the chamber walls from excessive deposition, extending maintenance intervals.
- High thermal conductivity to dissipate heat generated during plasma processes.
Application Scenarios:
- Deployed in 200mm PVD (Physical Vapor Deposition), PECVD, and Etch chambers.
- Critical for processes such as metal deposition, dielectric layer formation, and silicon etching.
