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AMAT 0200-01955
Product Name: 200mm Deposition Ring Assembly
Product Description: A precision-machined annular component used in PVD deposition chambers to optimize thin-film uniformity across 200mm wafers. It provides a stable boundary for plasma confinement and material deposition.
Technical Specifications:
- Wafer Compatibility: 200mm (8-inch) wafers
Detailed content
- Material: High-purity aluminum alloy with ceramic coating
- Outer Diameter: 220mm
- Inner Diameter: 204mm
- Surface Finish: Polished to Ra < 0.5 μm
- Weight: 0.31 kg
- Temperature Resistance: Up to 300°C
Functional Features:
- Enhances film thickness uniformity across wafer surface
- Reduces edge effects and over-deposition
- Resists sputtered material accumulation
- Minimizes particle generation during processing
- Ensures consistent process repeatability
- Easy installation and replacement during maintenance
Application Scenarios:
- Physical Vapor Deposition (PVD) systems
- 200mm semiconductor wafer manufacturing
- Titanium and tantalum deposition processes
- AMAT Endura PVD platforms
- Front-end-of-line (FEOL) metallization processes
