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AMAT 0190-88747 High-Sensitivity Temperature Sensor Module
Product Overview: The AMAT 0190-88747 is a high-sensitivity temperature sensor module designed for real-time temperature monitoring in Applied Materials semiconductor processing equipment. It provides precise, fast-response temperature measurements of critical components (chamber walls, heaters, wafers), enabling closed-loop process control and over-temperature protection. This module features advanced thermocouple technology, EMI shielding, and rugged packaging for reliable operation in harsh fab environments.
Technical Specifications:
- Sensor Type: K-type thermocouple, precision-grade, with a 1mm diameter Inconel sheath.
Detailed content
- Temperature Range: -50°C to 1000°C, with ±0.2°C accuracy (0–500°C) and ±0.4°C (500–1000°C).
- Response Time: ≤3ms, providing real-time temperature feedback.
- Cable: 2m Teflon-insulated, EMI-shielded cable, with a miniature thermocouple connector.
- Operating Environment: Resistant to plasma, process gases, and EMI; suitable for high-vacuum conditions.
- Output: Analog 0–10V and digital RS-485 signals for equipment control integration.
- Protection: Over-temperature alarm output (relay contact), with 1ms response time.
- Certification: Complies with SEMI S2/S8 safety standards and IEC 60584 thermocouple standards.
Functional Features:
- Delivers high-precision, fast-response temperature measurements for closed-loop process control.
- Resists EMI interference, ensuring stable readings in RF-rich plasma environments.
- Provides real-time over-temperature protection, preventing component damage and wafer loss.
- Integrates seamlessly with AMAT’s equipment control systems for process automation.
- Features rugged, corrosion-resistant construction for long-term reliability.
- Supports remote monitoring and data logging for process traceability.
Application Scenarios:
- Installed in AMAT process chambers for wafer and chamber wall temperature monitoring.
- Used in heater assemblies for thermal annealing and deposition processes.
- Applied in 200mm and 300mm wafer fabs for advanced logic and memory manufacturing.
- Ideal for processes requiring precise temperature control (≤±1°C).
- Deployed in R&D facilities for temperature-dependent process development.
