Digital guide
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Detailed content
- Power Output: 800W
- Input Voltage: 240V AC
- Frequency Stability: ±0.1%
- Material: Titanium alloy (radiating surface), stainless steel housing
- Dimensions: 300mm diameter circular array
- Mounting: Flange-style for chamber integration
Functional Features:
- Delivers uniform megasonic acoustic energy for gentle, effective particle removal
- Non-contact cleaning mechanism preserves delicate wafer surface structures
- High-frequency operation minimizes damage to low-k dielectric materials
- Precision power control for adjustable cleaning intensity
- Hermetically sealed construction for wet process environment compatibility
Application Scenarios:
- Post-CMP wafer cleaning systems
- Photoresist strip and particle removal processes
- Advanced semiconductor wafer surface preparation
- 300mm wafer cleaning modules in Mesa/Speedfam platforms
