Digital guide
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AMAT 0190-27350
Product Introduction:
The Lift Pin Assembly is a mechanical subsystem located within the wafer support pedestal (susceptor). It consists of pins that move vertically to lift the wafer off the pedestal surface, facilitating robotic handoff and cooling. This mechanism ensures the wafer does not stick to the pedestal due to vacuum chucking or thermal bonding.
Technical Specifications:
- Number of Pins: Typically 3 to 6 pins (e.g., 3-pin configuration for stability).
Detailed content
- Material: Ceramic (AlN, Al2O3) or Stainless Steel with wear-resistant coatings.
- Actuation: Pneumatic (bellows or cylinder) or Magnetic drive.
- Stroke Length: 2mm to 5mm typically.
- Vacuum Compatibility: Designed to operate without compromising chamber vacuum integrity.
Functional Features:
- Robotic Transfer: Elevates the wafer to align with the end-effector of the transfer robot.
- Thermal Management: Pins are often hollow or made of thermally conductive material to help cool the wafer backside during processing.
- Backside Gas Cooling: The pins allow Helium backside gas to flow even when lifted, aiding in temperature control during transfer.
- Stiction Prevention: Breaks the vacuum seal or thermal bond between the wafer and chuck.
Application Scenarios:
- Wafer Handling: Essential for all automated semiconductor processing tools.
- High-Temperature Processes: Critical for lifting wafers after high-temperature steps (e.g., Rapid Thermal Processing) where sticking is likely.
- Main Equipment: Applied Materials Producer, Centura, and Endura platforms.
