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- Product Introduction:
The wafer cleaning system is an essential part of semiconductor manufacturing to remove contaminants such as particles, organic residues, and metal ions from the wafer surface. A clean wafer surface is crucial for ensuring high – quality semiconductor device fabrication, as any contaminants can lead to device defects and reduced performance. - Technical Specifications:
- Cleaning Methods: It supports multiple cleaning methods, including wet cleaning (using chemical solutions such as sulfuric acid – hydrogen peroxide mixtures (SPM)
Detailed content
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- ammonia – hydrogen peroxide mixtures (APM), and hydrochloric acid – hydrogen peroxide mixtures (HPM)), and dry cleaning (using plasma or gas – phase cleaning techniques).
- Throughput: The system can clean a certain number of wafers per hour, with a typical throughput ranging from 50 to 200 wafers per hour, depending on the wafer size and the complexity of the cleaning process.
- Cleaning Chamber Size: The cleaning chamber is designed to accommodate wafers of different sizes, with a standard size that can hold up to 25 wafers of 300mm diameter simultaneously.
- Functional Features:
- Process Control: It has a sophisticated process control system that allows operators to set and monitor various cleaning parameters, such as chemical concentration, temperature, flow rate, and cleaning time. This ensures consistent cleaning results for each batch of wafers.
- Particle Removal Efficiency: The system is designed to achieve high particle removal efficiency, typically removing more than 99.9% of particles with a size of 0.1μm or larger from the wafer surface. This is achieved through a combination of mechanical agitation, chemical reactions, and rinsing steps.
- Chemical Recycling and Waste Treatment: It incorporates chemical recycling systems to reduce the consumption of expensive cleaning chemicals and minimize waste generation. The waste treatment system ensures that the used chemicals are properly treated before disposal to meet environmental regulations.
- Application Scenarios:
- Pre – Process Cleaning: Before each major semiconductor manufacturing process, such as lithography, etching, and deposition, the wafer cleaning system is used to clean the wafer surface to remove any contaminants that may have accumulated during previous processes or from the environment. This ensures that the subsequent process can be carried out under optimal conditions.
- Post – Process Cleaning: After processes such as etching or chemical mechanical polishing (CMP), the wafer cleaning system is used to remove the by – products and residues generated during these processes. This helps in improving the quality of the semiconductor device and preparing the wafer for the next process step.
