Digital guide
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AMAT 0190-12890
- Product Introduction:
This vacuum pump system is a key component in semiconductor manufacturing equipment that requires a high – vacuum environment, such as physical vapor deposition (PVD), chemical vapor deposition (CVD), and etching systems. It is responsible for creating and maintaining the low – pressure conditions necessary for these processes to occur effectively. - Technical Specifications:
- Pumping Speed: The system has a pumping speed range of 1000 L/s to 10000 L/s, depending on the model and configuration.
Detailed content
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- This high pumping speed allows for rapid evacuation of the process chamber to reach the desired vacuum level.
- Ultimate Vacuum Pressure: It can achieve an ultimate vacuum pressure as low as 10^-9 Torr, which is suitable for most high – end semiconductor manufacturing processes that require extremely low – pressure environments.
- Power Consumption: The power consumption of the system varies from 5 kW to 20 kW, depending on the pumping speed and operating conditions. Energy – efficient designs are incorporated to reduce power consumption while maintaining high – performance pumping.
- Functional Features:
- Multi – Stage Pumping: The system uses a combination of different types of pumps, such as rotary vane pumps, roots blowers, and turbomolecular pumps, in a multi – stage configuration. This allows for efficient pumping over a wide pressure range, from atmospheric pressure to ultra – high vacuum.
- Variable Speed Control: The pumps can operate at variable speeds, which enables the system to adjust the pumping speed according to the process requirements. This helps in optimizing energy consumption and reducing wear and tear on the pumps.
- Gas Ballast and Purge Functions: It has gas ballast and purge functions that allow for the handling of condensable gases and the prevention of back – streaming of pump oil into the process chamber. The gas ballast function introduces a small amount of dry gas into the pump to prevent the condensation of process gases, while the purge function uses an inert gas to clean the pump internals.
- Application Scenarios:
- Physical Vapor Deposition (PVD) Systems: In PVD processes like sputtering, a high – vacuum environment is required to ensure the proper flight of sputtered atoms from the target to the wafer. The vacuum pump system quickly evacuates the chamber to the required pressure and maintains it throughout the deposition process.
- Chemical Vapor Deposition (CVD) Reactors: For CVD processes, where chemical reactions occur at low pressures, the vacuum pump system creates the necessary vacuum conditions for the reactions to take place efficiently. It also removes the by – products of the reactions from the chamber to prevent contamination of the deposited films.
