Digital guide
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AMAT 0150-76735
Product Name: Electrostatic Chuck (ESC) Assembly
Product Introduction: A high-voltage device used to hold a semiconductor wafer firmly in place on a pedestal during processing using electrostatic force. It replaces mechanical clamping which causes particle issues.
Technical Specifications:
- Diameter: 300mm (12-inch) standard.
- Clamping Voltage: 0V to 2000V DC (bipolar or monopolar).
Detailed content
- Dielectric Material: Polyimide or Aluminum Nitride (AlN) ceramic.
- Cooling Gas: Helium backside cooling interface (10-20 Torr).
- Leakage Current: < 10 nA.
- Hold Down Force: > 200 Newtons uniformly distributed.
Functional Features: - Temperature Control: Integrated heater and cooler (Peltier or fluid) for precise wafer temperature control (-100°C to 400°C).
- Lift Pin Mechanism: Includes pins to lift the wafer off the chuck surface for robot hand-off.
- Endpoint Detection: Some models integrate optical sensors for in-situ process monitoring.
- RF Bias Compatibility: Designed to work with high RF bias power for ion energy control.
Application Scenarios: - Plasma Etching: Holds wafers during high-density plasma etching where mechanical clamps are impossible.
- PVD/CVD: Secures wafers during deposition to ensure thermal contact and prevent lifting due to gas pressure.
- Ion Implantation: Holds wafers at specific angles for precise dopant introduction.
