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AMAT 0150-14869
Product Name: Chamber Liner Kit for PVD Impulse Systems
Product Introduction: This is a consumable chamber liner kit specifically engineered for the Impulse PVD platform. It acts as a sacrificial shield to protect the main chamber walls from sputtering deposition, particle generation, and chemical corrosion during the physical vapor deposition process.
Technical Specifications:
- Material: High-purity Aluminum (Al) or Aluminum-Magnesium alloy (for specific barrier layers)
- Dimensions: Custom fit for 200mm and 300mm wafer processing chambers
Detailed content
- Surface Finish: Anodized or electro-polished to minimize particle adhesion
- Thermal Tolerance: Capable of withstanding process temperatures up to 600°C
- Lifetime: Defined by cumulative sputtering hours or thickness of deposited film
Functional Features: - Particle Control: Designed with specific geometry to trap flaking material and prevent particles from landing on the wafer.114.
- Uniformity Optimization: The shape of the liner influences the plasma sheath and deposition profile, aiding in film thickness uniformity across the wafer.
- Easy Replacement: Modular design allowing for quick removal and replacement during preventive maintenance (PM) to minimize tool downtime.
- Gas Distribution: Some variants include integrated channels for secondary gas injection to aid in plasma stabilization.
Application Scenarios: - Used extensively in the deposition of barrier layers (Ta/TaN) and seed layers for copper interconnects.
- Applied in the manufacturing of DRAM and NAND flash memory devices.
- Suitable for processes involving reactive sputtering where the chamber environment is highly corrosive.
