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AMAT 0150-14869
Product Name: Chamber Liner and Shield Kit for PVD Impulse Systems
Product Introduction:
This is a comprehensive consumable kit designed for the Applied Materials Impulse PVD platform, serving as the primary sacrificial barrier protecting the stainless steel chamber walls from physical sputtering, chemical corrosion, and thermal stress. The kit typically includes the main chamber liner, collimator shields, and dark space shields. By absorbing the deposition and preventing material flaking, it ensures particle-free processing and maintains the vacuum integrity of the system. The material selection and surface engineering are optimized to reduce particle generation and extend the mean time between preventive maintenance (PM).
Detailed content
Technical Specifications:
- Material Composition: High-purity Aluminum (6061-T6) or Aluminum-Magnesium alloy; some variants use anodized aluminum or Yttrium-coated aluminum for corrosion resistance.
- Dimensions: Custom-machined for 200mm and 300mm wafer configurations; includes specific geometries for the “throttle slot” area.
- Surface Finish: Electropolished or chemically brightened to a surface roughness (Ra) of less than 4 micro-inches to minimize particle adhesion.
- Thermal Properties: Capable of withstanding bake-out temperatures up to 150°C and process temperatures up to 600°C without warping.
- Anodization: Type II or Type III hard coat anodization (approx. 25 microns thick) for dielectric isolation and wear resistance.
Functional Features:
- Particle Trapping Geometry: The liner features stepped lips and recessed areas designed to capture flakes and redeposited material, preventing them from falling onto the wafer.
- Plasma Shaping: The physical profile of the liner influences the sheath potential and plasma density distribution near the chamber walls, aiding in edge exclusion control.
- Gettering Capability: Aluminum acts as a getter for oxygen and moisture, helping to maintain a high-purity vacuum environment during the process cycle.
- Modular Replacement: Designed for rapid removal and replacement using dedicated lift pins and handling tools, minimizing tool downtime (typically <30 minutes for a full change).
- Gas Distribution Integration: Some advanced kits include channels or slots that align with gas injectors to facilitate uniform gas distribution and prevent stagnation zones.
Application Scenarios:
- Copper Metallization: Used extensively during the sputtering of Copper seed layers and Tantalum/Tantalum Nitride barrier layers.
- Reactive Sputtering: Essential for processes involving Titanium or Aluminum targets in reactive environments (Nitrogen/Oxygen) where the chamber walls are prone to nitride/oxide buildup.
- Hard Disk Drive (HDD) Production: Applied in the sputtering of magnetic layers where chamber cleanliness is paramount to avoid media defects.
- Solar Cell Manufacturing: Used in the PVD deposition of back contacts and transparent conductive oxides (TCO) on large-area substrates.
