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AMAT 0060-22552
- Product Name: AMAT 0060 – 22552 Semiconductor Process Gas Purification System
- Product Introduction: The AMAT 0060 – 22552 is a gas purification system designed to remove impurities from process gases used in semiconductor manufacturing. High – purity process gases are essential for ensuring the quality and reliability of semiconductor devices, as even trace amounts of impurities can cause device defects and reduce yield.
- Technical Specifications:
- Purification Technology: Uses a combination of physical and chemical purification methods, including gettering, adsorption
Detailed content
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- and filtration. Gettering materials such as titanium and zirconium are used to remove reactive impurities, while activated carbon and molecular sieves are used for adsorption of organic and inorganic contaminants. High – efficiency filters are used to remove particles.
- Gas Flow Rate Range: Can handle a gas flow rate range from 1 sccm to 100 slm (standard liters per minute), making it suitable for a wide range of semiconductor processes with different gas consumption requirements.
- Purification Efficiency: Achieves a purification efficiency of over 99.9999% for most common impurities in semiconductor process gases, such as oxygen, water vapor, hydrocarbons, and metal ions.
- Functional Features:
- Continuous Operation: Designed for continuous operation, providing a stable supply of high – purity gas to the semiconductor process equipment. It has a built – in monitoring system that continuously checks the gas purity and alerts the operator in case of any degradation in purification performance.
- Modular Design: The system has a modular design, allowing for easy maintenance and replacement of purification components. This reduces downtime and ensures that the system can be quickly restored to its optimal purification performance.
- Low Pressure Drop: The purification components are designed to minimize the pressure drop across the system, ensuring that the gas can be delivered to the process equipment at the required pressure without excessive energy consumption.
- Application Scenarios:
- Etching Process: Supplies high – purity etching gases such as chlorine, fluorine – based compounds, and boron trichloride to the etching chambers. Removing impurities from these gases prevents the formation of unwanted by – products and ensures uniform etching of the wafer surface.
- Deposition Process: Provides high – purity precursor gases for chemical vapor deposition (CVD) and atomic layer deposition (ALD) processes. Impurity – free gases are crucial for achieving high – quality thin films with the desired electrical and physical properties.
