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AMAT 0050-70558

Product Name: Gas Manifold Assembly

Product Description: A precision-engineered gas manifold assembly for semiconductor process equipment, providing safe, controlled distribution of process gases to multiple chamber locations.

Technical Specifications:

  • Material: 316L stainless steel

Detailed content

  • Number of Gas Channels: 6
  • Port Size: 1/4″ VCR connections
  • Maximum Operating Pressure: 250 PSIG
  • Operating Temperature: -40°C to +90°C
  • Leak Rate: <1×10⁻⁹ atm-cc/sec He
  • Surface Finish: Electropolished internally to Ra <0.25μm
  • Compatibility: All standard semiconductor process gases

    Functional Features:

  • Multi-channel design for simultaneous gas distribution
  • High-integrity sealing for zero gas leakage
  • Compact, space-efficient configuration
  • Easy installation and maintenance
  • Chemical compatibility with aggressive process gases
  • Precision machining for reliable performance
  • Low particle generation for process purity

    Application Scenarios:

  • Semiconductor process gas delivery systems
  • CVD/ALD chamber gas injection
  • Etching process gas distribution
  • Vacuum chamber purging systems
  • Gas mixing and distribution manifolds

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