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AMAT 0050-41308 High-Purity Gas Line Weldment Assembly
Product Overview: The AMAT 0050-41308 is a precision-engineered gas line weldment assembly designed for the ultra-high-purity gas delivery systems of Applied Materials semiconductor equipment. It facilitates the safe, leak-tight transport of process gases (inert, reactive, corrosive) between gas cabinets, mass flow controllers, and process chambers. Manufactured with precision welding and electropolishing, this assembly ensures zero contamination, minimal dead volume, and maximum gas purity—critical for advanced semiconductor manufacturing processes.
Technical Specifications:
- Material: 316L VAR (Vacuum Arc Remelted) stainless steel, electropolished to Ra ≤ 0.05μm.
Detailed content
- Configuration: Multi-branch weldment with 6×1/4-inch VCR connections, total length 450mm.
- Weld Quality: Orbital TIG welding with 100% helium leak testing, leak rate ≤ 1×10⁻¹⁰ Pa·m³/s (He).
- Operating Pressure: Maximum working pressure 15 MPa (2175 psi), burst pressure 45 MPa (6525 psi).
- Temperature Range: -40°C to 120°C, suitable for all semiconductor fab environments.
- Surface Treatment: Internal electropolishing and passivation, external bead-blasted finish.
- Gas Compatibility: Compatible with Ar, N₂, O₂, H₂, SiH₄, NH₃, CF₄, Cl₂, and other process gases.
- Certification: Complies with SEMI F11 gas delivery standards and ISO 9001 quality control.
Functional Features:
- Delivers leak-tight gas transport with zero contamination, ensuring process gas purity.
- Minimizes dead volume and gas trapping, reducing cross-contamination between gas lines.
- Resists corrosion from reactive and corrosive gases, extending service life.
- Provides uniform gas flow with minimal pressure drop, ensuring consistent process performance.
- Integrates seamlessly with AMAT’s gas panel and mass flow controller assemblies.
- Designed for easy installation and maintenance, with standard VCR connections.
Application Scenarios:
- Installed in AMAT Centura, Endura, and Producer gas delivery systems.
- Used in CVD, PECVD, etch, and ALD processes for precise gas delivery.
- Applied in 300mm wafer fabs requiring ultra-high-purity gas delivery for advanced nodes (≤7nm).
- Ideal for high-volume production lines where gas purity and process consistency are critical.
- Deployed in R&D facilities for gas delivery system testing and process development.
