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AMAT 0050-21118 Gas Line Weldment
Product Overview: The AMAT 0050-21118 is a custom-engineered gas line weldment specifically designed for Applied Materials semiconductor manufacturing equipment. It serves as a critical component in the gas delivery system, responsible for securely connecting and transporting process gases between different modules of the equipment. This weldment is manufactured to strict OEM standards, ensuring seamless integration with AMAT’s gas delivery systems and maintaining the high purity and integrity required for semiconductor processing. It is a new component that meets all of AMAT’s original specifications, providing reliable performance in harsh fab environments.
Technical Specifications: – Material Composition: High-purity 316L stainless steel, selected for its excellent corrosion resistance and compatibility with a wide range of process gases, including reactive and corrosive varieties. – Weld Quality: Precision TIG (Tungsten Inert Gas) welding, ensuring leak-tight joints with a leak rate ≤ 1×10⁻⁹ Pa·m³/s (He) to prevent gas leakage and contamination.
Detailed content
– Dimensional Tolerance: ±0.01mm, guaranteeing precise fit and alignment with other gas delivery components such as manifolds, valves, and fittings. – Operating Pressure: Maximum operating pressure of 10 MPa (1450 psi), with a burst pressure of 30 MPa (4350 psi) for enhanced safety. – Operating Temperature: -20°C to 150°C, suitable for the temperature fluctuations commonly encountered in semiconductor fabs. – Surface Treatment: Electropolished internal surface with a surface roughness ≤ 0.1 μm to minimize gas adsorption and particle generation. – Certification: Complies with SEMI F11 standards for gas delivery components and ISO 9001 quality control requirements.
Functional Features: – Provides a secure, leak-tight connection for process gas transport, ensuring the integrity of the gas delivery system. – Minimizes dead volume and gas trapping, reducing the risk of cross-contamination between different process gases. – Resists corrosion from reactive and corrosive process gases, extending the component’s service life and reducing replacement frequency. – Ensures uniform gas flow through smooth internal surfaces, preventing pressure drops and maintaining consistent process conditions. – Integrates seamlessly with AMAT’s existing gas delivery components, eliminating compatibility issues and simplifying installation. – Designed to withstand the vibration and thermal cycling common in semiconductor manufacturing equipment, ensuring long-term stability.
Application Scenarios: – Primarily used in AMAT’s Centura, Endura, and Producer series semiconductor processing platforms. – Installed in the gas delivery systems of plasma etching, chemical vapor deposition (CVD), and physical vapor deposition (PVD) chambers. – Applied in 200mm and 300mm wafer manufacturing processes, including logic chips, memory chips (DRAM, NAND), and power semiconductor devices. – Suitable for high-volume semiconductor production lines where gas purity, leak tightness, and process consistency are critical. – Ideal for fabs processing with reactive or corrosive gases, where component durability and corrosion resistance are essential. – Used in research and development facilities for advanced semiconductor process development, where precise gas delivery is required.
