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AMAT 0041-76691
Product Name: 300mm CMP Retaining Ring
Product Description: A high-performance retaining ring for chemical mechanical planarization (CMP) systems that holds wafers securely during polishing while maintaining uniform pressure distribution.
Technical Specifications:
- Material: Filled PEEK (polyetheretherketone) composite
Detailed content
- Inner Diameter: 300 mm (wafer containment)
- Outer Diameter: 380 mm
- Thickness: 15 mm
- Hardness: 85 Shore D
- Compression Set: <2% at 200°C
- Chemical Compatibility: Inert to CMP slurries (SiO₂, Al₂O₃)
- Temperature Range: -10°C to +200°C
- Surface Finish: Precision-machined (Ra <1.6 μm)
Functional Features:
- Excellent wear resistance for extended service life
- High chemical stability to CMP slurries and cleaning agents
- Uniform radial flexibility for consistent wafer pressure
- Non-contaminating, low particle generation design
- Precision dimensional stability for planarization uniformity
Application Scenarios: Wafer containment in AMAT Reflexion 300mm CMP systems for dielectric and metal polishing processes.
