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AMAT 0041-38497
- Product Name: Chamber Liner Assembly
- Product Description: Precision-machined metallic chamber liner for semiconductor etch and deposition chambers. It protects the chamber body from process chemistry and defines the plasma reaction zone.
- Technical Specifications:
- Material: High-grade Aluminum Alloy (6061-T6)
Detailed content
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- Surface Coating: Hard-anodized (50μm thickness)
- Dimensions: 250mm ID x 300mm OD x 150mm Height
- Surface Finish: Ra ≤ 0.4 μm (polished)
- Flange Type: ISO-K NW-200 vacuum flange
- Weight: 4.5 kg
- Functional Features:
- High corrosion resistance to fluorine and chlorine plasmas
- Smooth, non-porous surface to minimize particle trapping
- Precision alignment slots for chamber centering
- Optimized gas flow channels for uniform process distribution
- High structural rigidity under thermal cycling
- Easy-to-clean, reusable design
- Applications: Plasma confinement liner in dielectric etch chambers; process chamber liner for P5000 and Centura Etch platforms.
