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AMAT 0041-13111
Product Name: 300mm Electrostatic Chuck (ESC) Pedestal Subassembly
Product Description: This component is a high‑precision electrostatic chuck assembly dedicated to semiconductor wafer processing equipment, used to achieve non‑contact clamping, precise temperature control and stable support for 300mm wafers in high vacuum and plasma environments. It is a core component to ensure wafer position accuracy and process repeatability.
Technical Specifications:
- Wafer Compatibility: 300mm monocrystalline silicon wafers and compound semiconductor wafers
Detailed content
- Chucking Method: Coulomb type / Johnsen‑Rahbek type electrostatic adsorption
- Operating Temperature Range: Ambient to 400°C
- Material Composition: High‑purity aluminum nitride ceramic, titanium alloy electrode layer, high‑temperature resistant sealing structure
- Vacuum Compatibility: Ultra‑high vacuum (UHV) level, low outgassing rate
- Surface Flatness: Micron‑level flatness to ensure full‑contact wafer adsorption
Key Features:
- Uniform electrostatic clamping force distribution, no wafer deformation or edge warping
- High thermal conductivity structure to achieve fast and stable temperature regulation
- Excellent resistance to plasma erosion, halogen corrosion and particle contamination
- Built‑in temperature sensing point, supporting closed‑loop real‑time temperature control
- High structural stability, suitable for long‑term continuous operation in mass production fabs
Application Scenarios:
Mainly used in AMAT Endura, Centura and Producer series platforms, supporting processes including physical vapor deposition (PVD), plasma enhanced chemical vapor deposition (PECVD), dielectric etching and metal etching, wafer annealing and surface treatment processes.
