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AMAT 0040-97734
- Product Name: Electrostatic Chuck (ESC), Ceramic
- Product Description: Advanced ceramic electrostatic chuck for wafer clamping and temperature control in plasma etch and deposition processes.
- Technical Specifications:
- Material: High-purity aluminum nitride (AlN) ceramic
Detailed content
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- Diameter: 300mm (compatible with 300mm wafers)
- Thickness: 25.4mm ± 0.03mm
- Clamping Voltage: 2,000V DC (monopolar)
- Temperature Range: -50°C to +500°C
- Leakage Current: <1μA at maximum voltage
- Functional Features:
- Provides uniform electrostatic clamping force across wafer surface
- Excellent thermal conductivity for precise wafer temperature control
- High dielectric strength prevents electrical breakdown
- Low particle generation design for ultra-clean processes
- Resistant to plasma erosion and chemical corrosion
- Application Scenarios:
- Used in AMAT MxP, MxP+, and eMxP+ etch chambers
- Applied in dielectric and metal etch applications
- Deployed in high-volume 300mm semiconductor manufacturing
- Utilized in advanced node fabrication processes (≤14nm)
- Suitable for processes requiring tight temperature uniformity
