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Technical Specifications:
- Material: 316L stainless steel / oxygen-free copper
- Cooling Channel Design: Helical or parallel flow channels
- Flow Rate: Up to 5 liters/minute
- Pressure Rating: 150 psig
- Operating Temperature: -10°C to +90°C
- Surface Finish: Passivated (stainless steel) / nickel-plated (copper)
- Leak Rate: < 1 × 10⁻⁸ atm-cc/sec He
Functional Features:
- High thermal conductivity for efficient heat transfer
- Excellent corrosion resistance to deionized cooling water
- Optimized flow design for uniform temperature distribution
- Pressure-tight construction for reliable operation
- Compact design for installation in confined spaces
Application: Used for active cooling of RF generators, matching networks, and high-temperature chamber components in semiconductor equipment.
