Digital guide
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AMAT 0040-77243
- Product Name: Ring Assembly, Composite, Retaining
- Product Description: High-performance composite retaining ring for wafer confinement in chemical mechanical planarization (CMP) processes.
- Technical Specifications:
- Material: Advanced polymer composite (PEEK with carbon fiber reinforcement)
Detailed content
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- Outer Diameter: 350mm
- Inner Diameter: 302mm
- Thickness: 6.35mm ± 0.05mm
- Hardness: 85 Shore D
- Temperature Resistance: Up to 250°C
- Functional Features:
- Excellent wear resistance in CMP slurry environments
- Low particle generation for high-quality wafer finishing
- Chemical resistance to CMP slurries and cleaning solutions
- Maintains dimensional stability under process conditions
- Non-abrasive to wafer edges
- Application Scenarios:
- Used in AMAT Mirra and Reflexion CMP systems
- Applied in dielectric and metal CMP processes
- Deployed in 300mm wafer planarization applications
- Utilized in advanced semiconductor device fabrication
- Suitable for shallow trench isolation (STI) and inter-layer dielectric (ILD) processes
