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AMAT 0040-76429 Tall Manifold
Product Overview: The AMAT 0040-76429 is a tall manifold (OTB, T1) designed exclusively for Applied Materials semiconductor equipment. It is a critical component in the gas delivery system, responsible for the distribution and regulation of process gases to the process chamber. This manifold is engineered with high-purity materials and precision machining to ensure minimal gas adsorption, particle generation, and leakage, making it ideal for the strict requirements of semiconductor manufacturing. It features a tall design to accommodate specific equipment configurations, providing seamless integration with AMAT’s gas delivery systems.
Technical Specifications: – Material Composition: High-purity 316L stainless steel with an electropolished internal surface (surface roughness ≤ 0.1 μm) to minimize gas adsorption and particle generation. – Design Type: Tall manifold (OTB, T1), with a height of 200mm and a diameter of 100mm, designed for specific AMAT equipment configurations.
Detailed content
– Gas Compatibility: Compatible with a wide range of process gases, including inert gases (Ar, N₂), reactive gases (SiH₄, NH₃), and corrosive gases (CF₄, Cl₂). – Flow Capacity: 500 standard liters per minute (SLPM) at 0.5 MPa outlet pressure, ensuring sufficient gas flow for high-volume production. – Connection Type: Swagelok tube fittings (1/4 inch) for leak-tight connections, with a leak rate ≤ 1×10⁻⁹ Pa·m³/s (He). – Operating Pressure: Maximum operating pressure of 10 MPa (1450 psi), with a burst pressure of 30 MPa (4350 psi). – Operating Temperature: -20°C to 80°C, suitable for the temperature range of semiconductor fabs. – Certification: Complies with SEMI F11 standards for gas delivery components and ISO 9001 quality control requirements.
Functional Features: – Distributes process gases from a single inlet to multiple outlets, ensuring uniform flow distribution to different parts of the process chamber. – Minimizes dead volume and gas trapping, reducing the risk of cross-contamination between different process gases. – Resists corrosion from reactive and corrosive process gases, extending the manifold’s service life. – Ensures precise gas flow control, working in conjunction with mass flow controllers (MFCs) to maintain consistent process parameters. – Features a tall design that accommodates specific AMAT equipment configurations, providing seamless integration. – Facilitates easy purging of the gas path, reducing process downtime between wafer lots. – Includes built-in check valves to prevent gas backflow, ensuring the integrity of the gas delivery system.
Application Scenarios: – Installed in AMAT’s gas delivery systems for Centura, Endura, and Producer series equipment. – Used in CVD, PECVD, and plasma etching systems for 200mm and 300mm wafer manufacturing. – Applied in processes requiring precise gas distribution, such as thin film deposition and plasma etching. – Suitable for high-volume semiconductor production lines, where gas flow consistency and equipment integration are critical. – Ideal for fabs using a variety of process gases, where cross-contamination must be minimized. – Used in research and development facilities for advanced gas delivery system testing and optimization.
