Digital guide
You are here:
AMAT 0040-76428
Product Name: CMP Retaining Ring / Profile Ring
Product Description: A precision-machined component for Chemical Mechanical Planarization (CMP) systems, designed to retain the wafer on the polishing platen and ensure uniform material removal.
Technical Specifications:
- Material: High-performance composite or engineered polymer (e.g., PPS, PEI).
Detailed content
- Design: Precision-machined with a contoured profile to optimize slurry flow and wafer stability.
- Dimensions: Exact OEM tolerances for compatibility with specific CMP heads (e.g., Titan Head).
- Wear Resistance: Coated or infused for extended life in abrasive CMP environments.
Functional Features:
- Exceptional chemical resistance to CMP slurries and cleaning solutions.
- Maintains consistent wafer planarity and polishing uniformity.
- Low particle generation to preserve wafer cleanliness.
- High structural rigidity under polishing pressure.
Application Scenarios:
- Used in AMAT Mirra and Reflexion CMP systems for 200mm/300mm wafer planarization.
- Applied in dielectric, metal, and STI CMP processes.
