Digital guide
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AMAT 0040-75377
Product Name: Heater Manifold Assembly
Product Description: A precision-engineered heater manifold assembly designed for uniform temperature distribution in semiconductor process chambers, ensuring consistent wafer processing conditions.
Technical Specifications:
- Material: 316L stainless steel
Detailed content
- Number of Heating Zones: 4
- Power Rating: 1200W total (300W per zone)
- Voltage: 240V AC
- Temperature Control Range: 50°C to 450°C
- Temperature Uniformity: ±2°C across manifold surface
- Operating Pressure: UHV compatible (10⁻⁹ Torr)
- Dimensions: 300mm diameter × 50mm thickness
- Weight: 2.2kg
Functional Features:
- Uniform temperature distribution for consistent processing
- Multi-zone control for precise temperature management
- High-efficiency heating elements for fast response
- Corrosion-resistant construction for process compatibility
- Easy installation and maintenance
- Precision machining for perfect chamber fit
- Low particle generation during operation
Application Scenarios:
- Semiconductor process chamber temperature control
- PVD/CVD equipment heating systems
- Wafer processing thermal management
- Vacuum chamber temperature uniformity systems
- Semiconductor manufacturing process integration
