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Technical Specifications:
- Material: 6061 aluminum alloy, hard anodized
- Hole Pattern: Multi-point precision drilled gas holes
- Hole Diameter: 0.5 mm to 1.0 mm (uniform distribution)
- Surface Coating: 25 μm thick hard anodized layer
- Flatness: < 5 μm across entire surface
- Operating Temperature: Up to 350°C
- Vacuum Compatibility: UHV-rated
Functional Features:
- Uniform gas distribution for consistent wafer processing
- High corrosion resistance to process gases and byproducts
- Smooth surface to minimize particle accumulation
- Precise machining for optimal gas flow dynamics
- Easy cleaning and maintenance procedures
Application: Installed in CVD and ALD chambers to ensure uniform gas distribution across 200mm/300mm wafers.
