Digital guide
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AMAT 0040-52451
Product Name: TXZ Process Chamber Shower Head Assembly
Product Description: A precision-engineered shower head assembly for TXZ series semiconductor process chambers, providing uniform gas distribution for consistent thin-film deposition processes.
Technical Specifications:
- Material: 316L stainless steel
Detailed content
- Diameter: 300mm
- Thickness: 12mm
- Number of Gas Holes: 1200 (0.5mm diameter)
- Hole Pattern: Uniform hexagonal distribution
- Surface Finish: Electropolished internally to Ra <0.2μm
- Operating Pressure: 0–10 Torr
- Operating Temperature: -20°C to +150°C
- Gas Compatibility: All standard semiconductor process gases
- Leak Rate: <1×10⁻⁹ atm-cc/sec He
Functional Features:
- Uniform gas distribution for consistent film thickness
- High-density hole pattern for excellent process uniformity
- Smooth internal surfaces to minimize flow resistance
- Corrosion-resistant construction for process compatibility
- Easy installation and maintenance
- Precision machining for perfect chamber fit
- Low particle generation during operation
Application Scenarios:
- TXZ series semiconductor deposition chambers
- Chemical Vapor Deposition (CVD) systems
- Atomic Layer Deposition (ALD) equipment
- Thin-film deposition process tools
- Semiconductor manufacturing process chambers
