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AMAT 0040-43978 Upper Chamber Liner
Product Overview: The AMAT 0040-43978 is a precision upper chamber liner designed for use in the process chambers of Applied Materials semiconductor equipment. It serves as a protective barrier between the chamber body and the harsh process environment, preventing damage from plasma erosion, chemical attack, and high temperatures. This liner is manufactured from high-performance materials with precise machining, ensuring a perfect fit within the chamber and maintaining the integrity of the process environment. It is a critical component for extending the service life of the process chamber and ensuring consistent process performance.
Technical Specifications: – Material Composition: High-purity aluminum oxide (Al₂O₃) ceramic or silicon carbide (SiC), selected for its excellent plasma resistance and thermal stability. – Dimensions: Outer diameter 300mm, inner diameter 280mm, height 150mm, with a surface roughness ≤ 0.2 μm. – Dimensional Tolerance: ±0.01mm, ensuring precise fit within the process chamber.
Detailed content
– Operating Temperature: Maximum continuous operating temperature of 1000°C, with short-term resistance up to 1200°C. – Plasma Resistance: Resistant to erosion from plasma (CF₄, Cl₂, Ar) and process gases, minimizing material loss. – Thermal Conductivity: 40 W/m·K (Al₂O₃) or 150 W/m·K (SiC), ensuring effective heat dissipation. – Weight: 2.5kg (Al₂O₃) or 3.2kg (SiC), designed for easy installation and replacement. – Certification: Complies with SEMI F17 standards for ceramic components and ISO 9001 quality control requirements.
Functional Features: – Protects the process chamber body from plasma erosion and chemical attack, extending the chamber’s service life. – Maintains the cleanliness of the process environment by preventing particle generation from chamber body wear. – Ensures uniform plasma distribution within the chamber, contributing to process uniformity across the wafer. – Withstands high temperatures and thermal cycling without warping or cracking, ensuring long-term reliability. – Facilitates easy cleaning and maintenance, as the liner can be removed and replaced without disassembling the entire chamber. – Integrates seamlessly with AMAT’s process chamber designs, ensuring compatibility with other components such as electrodes and gas injectors. – Reduces maintenance costs by minimizing the need for chamber body repairs or replacement.
Application Scenarios: – Installed in AMAT’s Centura and Endura series process chambers for plasma etching and CVD. – Used in 300mm wafer manufacturing lines for logic chips, memory chips (DRAM, NAND), and power semiconductor devices. – Applied in high-volume semiconductor production lines where chamber maintenance frequency and process consistency are critical. – Suitable for processes using reactive or corrosive gases, where component durability is essential. – Ideal for fabs looking to extend the service life of their process chambers and reduce maintenance downtime. – Used in research and development facilities for advanced process chamber testing and optimization.
