Digital guide
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AMAT 0040-34815
Product Name: High-Temperature Electrostatic Chuck Cover Ring
Product Description: A precision-machined component installed around the electrostatic chuck (ESC) to protect the ESC edge, stabilize plasma distribution, and improve wafer temperature uniformity.
Technical Specifications:
- Material: High-purity ceramic or high-performance polymer composite
Detailed content
- Temperature Resistance: Continuous service up to 350°C
- Dielectric Strength: ≥15 kV/mm
- Surface Finish: Ra ≤0.4 μm
- Compatibility: Designed for 200mm/300mm ESC assemblies
Functional Features:
- Provides electrical isolation to prevent arcing around the chuck edge
- Reduces thermal gradients for improved wafer temperature uniformity
- Resists plasma erosion and chemical corrosion
- Low outgassing and particle generation for vacuum compatibility
- Ensures consistent plasma confinement across wafer diameter
Application Scenarios: Used in PVD, etch, and ALD chambers with electrostatic wafer clamping systems.
